Solder Paste No-Clean Au80/Sn20 Gold/Tin in 5cc syringe 5g, w/plunger & tip, T5 mesh
Specifications
Alloy: Au80/Sn20
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 89% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 280C (536F)
Size: 5cc/5g syringe
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
