Gold/Tin (80 percent Gold, 20 percent Tin) Solid Core Solder Wire. Eutectic, melts at 280C (536F). Au80/Sn20 alloy offers good wetting, high strength, and low creep. It has excellent corrosion resistance and a high thermal conductivity. Au80/Sn20 can be brazed without flux and is suitable for use in vacuum environments. This alloy is used in many applications, including die attachment of semiconductor packages and metal lids.
Common Applications
High Reliability
Die Attachment
Lid Sealing
Brazing
Specifications
Alloy: Au80/Sn20
Diameter: 0.030" (0.762mm)
Length: 3" (76.2mm)
Net Weight: 0.5 grams
Melting Point: 280C (536F)
Solid core wire, no flux.
Density: 14.51 g/cm^3
Tensile Strength: 40,000 psi
Shear Strength: 40,000 psi
Young's Modulus: 8.57 x10^6 psi
CTE (Coefficient of Thermal Expansion): 16 ppm/C (at 20C)
Thermal Conductivity: 57 W/mK
Shelf Life: >60 months
