This adapter allows a SOIC-18 Wide (300 mil body, 0.050"/1.27mm pitch) footprint on a motherboard to be soldered to and wired out to DIP-18 (fits 0.3" row width) plated through holes above, for easy probing and debugging access, or for replacement with a DIP IC.
SPECIFICATIONS:
PCB dimensions: 0.4 x 0.9 x 0.063 inches.
PCB construction: FR-4 UL94V-0.
PCB operating temperature range: -40C to +130C.
PCB reflow maximum temperature: +260C.
PCB Assembly standard: IPC-A-610 Class II.
Top side of board fits DIP-18 IC, 0.3" row width (DIP300). Bottom side of PCB has SMD pads for the SMD-SMD header that converts to a SOIC-18W footprint.
